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felix_ | iirc the final module will get some sort of case; i wonder though how the cooling of the fpga should work then | 19:13 |
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Bertl | metal case? ventilation? | 20:00 |
felix_ | i don't know; i'd just use a heatsink and no fan, since the one fan on the zynq board is already quite annoyingly loud | 20:03 |
se6astian | what power consumption can we expect from that FPGA? | 20:03 |
Bertl | felix_: the fan situation will improve dramatically in the future | 20:04 |
felix_ | uh, i didn;t do any measurements on how much current the fpga on the prototype of the sdi board needs | 20:05 |
felix_ | very good | 20:05 |
se6astian | so I would propose to cool the fpga passively by thermally connecting it to its enclosure metal, knowing roughly what power consumption we are dealing with would help though | 20:15 |
se6astian | but looking at the trenz module I guess its not that much | 20:16 |
felix_ | about up to 1,2w for the 3 sdi chips combined and maybe 2.5w for the fpga | 20:20 |
felix_ | (not really sure about the latter one) | 20:21 |
felix_ | i currently have no microsoft office installed and last time i checked the xilinx power estimation thing doesn't work with other office programs | 20:22 |
felix_ | hm, ok, seems that the fpga will probably consume less power; maybe 1,5w | 20:26 |
se6astian | right | 20:29 |
se6astian | that sounds reasonable | 20:30 |
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Kjetil | What kind of package does the FPGA have? Is it plastic or metal ? | 20:59 |
felix_ | some sort of plastic(?) | 21:01 |
felix_ | not one with a metal lid | 21:01 |
Kjetil | Then I guess the heat dissipation is mainly through the PCB | 21:03 |
felix_ | hm, i don't know if that package is flip-chip or wire-bond | 21:08 |
Bertl_oO | easy to tell if you check the pinout vs. the bank view :) | 21:57 |
Bertl_oO | (in vivado) | 21:57 |
felix_ | the chips i consider using are all wire-bond | 22:19 |
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